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The Sultanate of Oman announces two agreements at the conclusion of the 2025 Semiconductor Summit and strengthens its focus on the semiconductor and electronic chip industry


Date Published: 11 December 2025

Digital Industry

The conclusion of the Global Summit for Semiconductor and Electronic Chip Executives 2025, hosted by the Sultanate of Oman represented by the Ministry of Transport, Communications, and Information Technology and organized by the International Semiconductor Manufacturing Group, was marked by the announcement of two agreements. These agreements are considered the most significant outcomes of the summit, aiming to develop the semiconductor ecosystem and build specialized national capacities in this field.

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A cooperation agreement has been signed between the Department of Electrical Engineering at Sultan Qaboos University and Kaynes Technology to launch a specialized training program in the field of chip design and semiconductor solutions development, aimed at qualifying national competencies and building a solid knowledge base in this sector. Aknan Company also signed a commercial cooperation agreement with Epic Semi to enhance industrial partnerships in the field of semiconductor manufacturing and development technologies and to expand opportunities for joint investment. In addition, the establishment of the Semiconductor and Electronic Chips Center of Excellence was announced to serve as a national platform for research, development, and capacity building.

The summit also witnessed the signing of several memoranda of cooperation and partnership with local and international companies in the fields of training, cybersecurity, and the development of semiconductor applications and electronic chips, which enhances the readiness of the Sultanate of Oman to develop a comprehensive technological infrastructure in line with global best practices.

Workshops

During the second day of the summit, several specialized working papers were reviewed, addressing the latest innovations in materials science and high-performance packaging technologies, improving chip manufacturing efficiency, the integration of active and passive devices, micro-sensors, and MEMS technologies, in addition to the regional advanced manufacturing initiative that focuses on developing local chip manufacturing capabilities and enhancing integration between regional markets.

The summit also featured a panel discussion on the semiconductor ecosystem in China, during which speakers reviewed China's capabilities in supply chains, manufacturing, and advanced infrastructure, while discussing opportunities for collaboration and leveraging Chinese expertise to enhance regional manufacturing capabilities and develop future technologies.

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